• The manufacturer's datasheet on the device is obtained and evaluated by an engineer.
• A specific device test quote is established.
• Specific test routines are then written by the engineer based on the device's key functional aspects.
• Following the development of the device test application, the engineer then migrates these tests and hardware layouts to our mixed signal test platforms. From this point, high volume device testing can be completed.

• We have custom internally designed hardware integrated with our test systems that are usable for testing virtually all devices.
• Significantly reduced NRE/development fees per device.
• Verifies die presence.
• Verifies continuity from leads to bond pads.
• Verifies overall device health by evaluating current pull during nominal power-up and operation.
• Confirms a subset of device functionality as determined by our engineers.
• Turn time is amongst the quickest in the industry, often within 4 - 7 business days of receiving parts for sample lot size testing, including high pin count QFPs and BGA packages.

A variety of key functional parameters are developed and implemented by our engineers per manufacturer specifications to verify both authenticity and functionality of a device. The counterfeit screening process will identify remarked and defective devices, preventing them from entering or continuing through the supply chain.

Visual inspections are performed on all incoming material following IDEA 1010 and appropriate MIL-STD-883 standards. Cross referencing the original manufacturer’s datasheet specifications, our lab technicians examine external packaging for signs of: damage, extra marking, remarking, blacktopping and reuse. The leads are also examined for signs of: re-working, prior use, damage, bends and breaks. The lab technician will verify quantity, identify date codes and create a digital photographic record.

Decapsulation is a destructive die verification process that involves exposing the internal die of an IC or component. This process allows us to microscopically reveal the internal part number and logos supplied by the original component manufacturer. These markings can then be compared to the external markings for clear and conclusive authentication.

Many devices have multiple potential ratings, whether it be temperature (Commercial, Industrial, Space, etc.) or rated speed. Due to availability constraints, users may procure material at a lower rating and have it tested at the more demanding rating their end application requires (for example, utilizing Commercial rated parts where the typical requirement may be Industrial rated parts).

Our team has the hardware and ability to meet the stringent parameters required for MIL-STD-883, Group 'A' testing. This is often requested by end users of material going into mission critical applications (Military, Medical, etc).